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Direct Acid Copper Plating Process FI-ZL001

অন্যান্য ভিডিও
May 20, 2021
শ্রেণী সংযোগ: তামা ধাতুপট্টাবৃত রাসায়নিক
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ট্যাগ:
#তামা তড়িৎ বৈদ্যুতিন সংযোগকারী #কপার ধাতুপট্টাবৃত আলোকসজ্জা #তামা ধাতুপট্টাবৃত additives
সংক্ষিপ্ত: Discover the Direct Acid Copper Plating Process FI-ZL001, a cyanide-free solution for bright copper plating on steel substrates. Ideal for continuous plating, this process offers high-speed plating, excellent deep plating ability, and easy wastewater treatment.
সংশ্লিষ্ট পণ্যের বৈশিষ্ট্য:
  • Cyanide-free acid copper plating on steel and iron substrates, perfect for continuous plating.
  • Can replace semi-bright nickel, watt nickel, or cyanide alkali copper plating as a base layer.
  • Achieves copper plating layer thickness of over 200μm.
  • Environmentally friendly with easy wastewater treatment and minimal pollution.
  • Simple bath maintenance and long service life.
  • High-speed copper plating with high current efficiency and good deep plating ability.
  • রিল-টু-রিল বৃহৎ কারেন্ট উচ্চ-গতির কপার প্লেটিংয়ের জন্য আদর্শ।
  • Operates at 20-40℃ with a cathode current density of 1-10A/dm2.
সাধারণ জিজ্ঞাস্য:
  • What substrates are suitable for the Direct Acid Copper Plating Process FI-ZL001?
    This process is specifically designed for steel and iron substrates, making it ideal for continuous plating applications.
  • How does the FI-ZL001 process compare to traditional cyanide copper plating?
    The FI-ZL001 process is cyanide-free, offering easier wastewater treatment, less environmental pollution, and can replace traditional cyanide alkali copper plating as a base layer.
  • What are the operational conditions for the FI-ZL001 plating process?
    The process operates at 20-40℃ with a cathode current density of 1-10A/dm2, using copper sulphate, sulfuric acid, and specific additives (A, B, C) in the bath makeup.
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